MPi Logic Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is extensively applied on gold bump and pad wafer testing for Screen driver, logic, and memory product. MPI’s cantilever probes are classified as the corresponding reply on the demands of fi­ne pitch, compact pad dimension, large speed, considerably less cleaning, multi-DUT, significant pin count, and ultra-reduced leakage demands. With fantastic craftsmanship, progressive architecture and verified methodologies according to mechanical and electrical simulation/measurement effects, generating MPI the top cantilever company around the world.


FCB Probe Card

The FCB Probe Card is considered the most mature know-how of buckling beam probe card. It's aimed to accomplish the semiconductor ship manufacture time-to-sector (TTM) and price of take a look at (COT) demand. FCB is a verified Alternative for many different semiconductor production assessments from early engineering pilot-runs to significant quantity manufacturing (HVM). FCB is prepared for machine requiring high signal integrity probing (SI) and/or electricity integrity probing (PI). Apps include things like slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus more. FCB guarantees the entire world’s ideal Over-all Price tag-of-possession (COO) for a variety of DUT programs.


EVS Probe Card

The EVS Probe Card is undoubtedly an enhancement over the standard buckling beam probe card. Crucial functions are higher existing carrying capacity (C.C.C.) and lower well balanced Make contact with drive (BCF), as well as overall MEMS-like attributes. EVS can easily meet up with the prerequisite of Sophisticated wafer probing. Specific alignment and exceptional planarity Management would be the critical things contributing to secure Speak to resistance. With its capacity and functionality, EVS Probe Card is an ideal choice for Innovative probe playing cards.


Osprey probe card

The Osprey probe card is MPI’s Resolution to demand for at any time finer pitch. It is designed for smaller sized Al pad, and is also ideal for small pitch software with peripheral and comprehensive array sample. With precise alignment and better planarity Handle, Osprey can access better productiveness by multi-DUT style and design.  The forming wire (FW) form needle generated with MPI’s individual micro fabrication system not simply delivers high-top quality effectiveness and also lets straightforward needle replacement and shortens retaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is equipped with MEMS wire (MW) needle which is created for the demand of small drive probing. What's more, it comes along with the chance to fulfill substantial C.C.C. and large pin counts software. The MEMS system ensures very steady needle properties, as well as the Unique composition design permits specific alignment and planarity Command.


MPI probe card division provides a wide range of solutions to here the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

Leave a Reply

Your email address will not be published. Required fields are marked *